QUELQUES ASPECTS THEORIQUES DE L'EMISSION ELECTRONIQUE SECONDAIRE DU CUIVRE, PRODUITE PAR BOMBARDEMENT D'ELECTRONS DE FAIBLE ENERGIECAILLER M; GANACHAUD JP.1972; J. PHYS.; FR.; DA. 1972; VOL. 33; NO 10; PP. 903-913; ABS. ANGL.; BIBL. 16 REF.Serial Issue

LA CORROSION FISSURANTE SOUS TENSION DES ACIERS = STRESS CORROSION CRACKING OF STEELSROSSET CAILLER M.1979; REV. PRAT. CONTROLE INDUSTR.; FRA; DA. 1979; VOL. 18; NO 100; PP. 27-29Article

THE EFFECT OF PLASTIC DEFORMATION ON SURFACE COMPOSITION OF AUSTENITIC STAINLESS STEEL = EFFET D'UNE DEFORMATION PLASTIQUE SUR LA COMPOSITION EN SURFACE D'UN ACIER INOXYDABLE AUSTENITIQUEROPTIN D; CAILLER M.1980; SCR. METALL.; ISSN 0036-9748; USA; DA. 1980; VOL. 14; NO 10; PP. 1139-1142; BIBL. 5 REF.Article

TRAITEMENT UNIFIE DE L'EMISSION ELECTRONIQUE SECONDAIRE DU CUIVRE PAR UNE METHODE DE MONTE CARLOGANACHAUD JP; CAILLER M.1973; J. PHYS.; FR.; DA. 1973; VOL. 34; NO 1; PP. 91-98; ABS. ANGL.; BIBL. 25 REF.Serial Issue

A NON-LINEAR DYNAMICAL RESPONSE OF AN ELECTRON GASBOURDIN JP; GANACHAUD JP; CAILLER M et al.1979; PHYS. LETTERS, A; NLD; DA. 1979; VOL. 71; NO 4; PP. 356-358; BIBL. 5 REF.Article

A SIMULATION OF THE TRANSMISSION OF 1 KEV ELECTRONS THROUGH THIN FILMS OF ALUMINUM, COPPER AND GOLD.DEJARDIN HORGUES C; GANACHAUD JP; CAILLER M et al.1976; J. PHYS. C; G.B.; DA. 1976; VOL. 9; NO 22; PP. L633-L636; BIBL. 20 REF.Article

SPURIOUS EFFECTS OF ELECTRON EMISSION FROM THE GRIDS OF A RETARDING FIELD ANALYSER ON SECONDARY ELECTRON EMISSION MEASUREMENTS. RESULTS ON A(111) COPPER SINGLE CRYSTAL.PILLON J; ROPTIN D; CAILLER M et al.1976; REV. PHYS. APPL.; FR.; DA. 1976; VOL. 11; NO 6; PP. 751-759; ABS. FR.; BIBL. 14 REF.Article

ELECTRICAL PROPERTIES OF SPUTTERED AIN FILMS AND INTERFACE ANALYSES BY AUGER ELECTRON SPECTROSCOPYHANTZPERGUE JJ; PAULEAU Y; REMY JC et al.1981; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1981; VOL. 75; NO 2; PP. 167-176; BIBL. 15 REF.Article

NEW THEORETICAL RESULTS ABOUT THE ANISOTROPY OF THE SECONDARY EMISSION OF AL(001) AND AL(110)GANACHAUD JP; CAILLER M; ABERDAH D et al.1979; SURF. SCI.; ISSN 0039-6028; NLD; DA. 1979; VOL. 87; NO 1; PP. 129-140; BIBL. 7 REF.Article

Adhesion studies of sputtered aluminium films on XC 70 steel substrates. Effect of the application of a bias voltage on the substrate during depositionLAHMAR, A; CAILLER, M.Thin solid films. 1994, Vol 248, Num 2, pp 204-211, issn 0040-6090Article

Scratch adhesion test of magnetron-sputtered copper coatings on aluminium substrates: effects of the surface preparation = Essai d'adhésion par rayage de revêtements de cuivre pulvérisés au magnétron sur des substrats d'aluminium: influences de la préparation de la surfaceCAILLER, M; LEE, G. H.Thin solid films. 1989, Vol 168, Num 2, pp 193-205, issn 0040-6090Article

Adhesion strength of copper thin-films to a E24 carbon steel : effects of substrate surface ion bombardment etchingCAILLER, M; OUIS, A; SCHULTZ, P. J et al.Journal of adhesion science and technology. 1993, Vol 7, Num 2, pp 141-157, issn 0169-4243Article

Bilan de la campagne de mesures effectuée sur un voilier de 7,70 m. Discussion = Results of the experimental and theoretical modeling realized on a 7,70 m sailing boat. DiscussionBALEY, C; CAILLER, M; AUCHER et al.Bulletin de l'Association technique maritime et aéronautique. 1994, Vol 94, pp 163-183, issn 0066-9814Conference Paper

Adhesion studies of magnetron-sputtered copper films on nickel substrates: effects of substrate surface pretreatments = Etude de l'adhérence de couches de cuivre pulvérisées par magnétron sur des substrats de nickel: influence de prétraitements de la surface du substratLEE, G. H; CAILLER, M; KWON, S. C et al.Thin solid films. 1990, Vol 185, Num 1, pp 21-33, issn 0040-6090Article

Traitement par décapage ionique avant dépôt: effet de la nature du gaz sur la force de liaison interfacial d'une couche d'aluminium sur un substrat en acier XC70 = Ion beam etching prior to coating : gas nature effect on the interface adhesion strength of an aluminium layer on medium carbon steelLAHMAR, A; CAILLER, M.Le Vide, les couches minces. 1994, Vol 50, Num 272, pp 213-225, issn 0223-4335Conference Paper

Mechanical characterization by dynamical tensile loading of 2017 aluminium alloy joints welded by diffusion bondingCAILLER, M; DEBBOUZ, O; DANNAWY, M et al.Journal of materials science. 1991, Vol 26, Num 18, pp 4997-5003, issn 0022-2461Article

Particle induced electron emission. IRÖSLER, M; BRAUER, W; DEVOOGHT, J et al.Springer tracts in modern physics. 1991, Vol 122, issn 0081-3869, 139 p.Serial Issue

Monte Carlo evaluation of the influence of the interaction cross sections on the secondary-electron-emission yields from polycrystalline aluminum targetsDUBUS, A; DEHAES, J.-C; GANACHAUD, J.-P et al.Physical review. B, Condensed matter. 1993, Vol 47, Num 17, pp 11056-11073, issn 0163-1829Article

Adhesion studies of magnetron sputtered copper films on steel substrates : effects of heat treatmentsLAHMAR, A; LEE, G. H; CAILLER, M et al.Thin solid films. 1991, Vol 198, Num 1-2, pp 115-137, issn 0040-6090, 23 p.Article

Adhesion enhancement of magnetron-sputtered copper films by ion bombardment etching treatment of nickel and Inconel substrates : investigations by Auger electron spectroscopy and secondary ion mass spectroscopy of the ion beam effectsCAHOREAU, M; LEE, G. H; CAISSO, J et al.Journal of adhesion science and technology. 1991, Vol 5, Num 11, pp 987-999, issn 0169-4243Article